Hanoi Stock Exchange (HNX) has just announced that Vietnam Technological and Commercial Joint Stock Bank (Techcombank, code: TCB) issued 2,000 bonds with code TCB12507, face value of VND1 billion/bond, equivalent to the successfully mobilized amount of VND 2,000 billion.
The bond lot has a term of 24 months and is expected to mature on May 9, 2027, with an issuance interest rate of 5.1%.
This is the 7th bond lot successfully mobilized by this bank in 2025. Previously, on April 28, this bank carried out two large issuances. The bond lot with code TCB12505 includes 1,500 bonds, equivalent to a total value of VND1,500 billion, a term of 24 months, maturing on April 28, 2027.
On the same day, Techcombank continued to issue an additional batch of TCB12506 bonds with a term of 3 years, with a total issuance value of up to VND 2,800 billion, maturing on April 28, 2028.
In the three days from April 21 to 23, 2025, this bank also consecutively issued 4 batches of bonds with codes from TCB12501 to TCB12504 with a total issuance value of these 4 batches reaching VND 9,200 billion.
Thus, since the beginning of the year, Techcombank has successfully mobilized VND 15,500 billion from bonds.
On the other hand, on April 10, Techcombank early settled the TCBL2427001 bond batch with a total value of VND 3,000 billion. This batch of bonds was issued from April 10, 2024, with a term of 36 months.
